- iSABers Group Co., Ltd.
The company's core competencies lie in R&D and manufacturing of advanced bonding equipment and high-precision bonding process solutions, with applications spanning cutting-edge domains including advanced packaging, semiconductor device fabrication, wafer-level heterogeneous integration, and MEMS sensor production.
Through its dual-drive strategy of "Equipment Manufacturing + Process Services", the company delivers end-to-end semiconductor bonding solutions. Its proprietary technology portfolio comprises four self-developed product lines with independent IP rights: Ultra-High Vacuum Room-Temperature Bonding Systems, Hybrid Bonding Equipment, Thermocompression Bonding Systems, and Customized Process Service Packages.
Driven by continuous innovation, iSABers is committed to providing high-precision, process-stable, and cost-competitive bonding technologies to the global semiconductor ecosystem, empowering strategic emerging industries.
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- 2020
- Founded
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- 30000+
- Site Area
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- 5
- R&D & Production Centers
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- 200+
- Global Patents
Subsidiary
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- Ultra-high Vacuum Technology
- Overcoming challenges in activation and alignment under vacuum environments.
01 -
- Surface Activation Technology
- Mastered full-spectrum surface activation technologies (ICP/CCP/FAB), enabling complete coverage of all wafer bonding applications.
02 -
- Sub-micron Precision Alignment Technology
- Expertise in Face-to-face, Inter-chip Coaxial, and Infrared Transmissive methods.
03 -
- Temperature and Pressure Control Technology
- Ensured high-temperature/high-pressure uniformity
04 -
- Single-wafer Spin Coating/ Cleaning Technology
- High-speed rotational balance and contamination-free processes guarantee exceptional bonding yield.
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