Headquarters relocated to Tianjin Hi-Tech Industrial Park and rebranded as iSABers Group Co., Ltd.

Launched the world's first independently developed C2W&W2W dual-mode SAB8210CWW equipment, leading the direction of heterogeneous integration technology. 

The second phase of the heterogeneous integration device production line has been put into operation, with an annual capacity exceeding one hundred units, significantly enhancing delivery capabilities.

Room-temperature bonding and 12-inch thermal compression bonding equipment have been mass-adopted by leading domestic and international customers, successfully entering the global market and achieving applications across multiple fields. 

The 12-inch TCB bonding equipment has been delivered, and the super-atom beam equipment has been independently developed successfully, supporting advanced packaging needs and achieving a breakthrough in core processes from 0 to 1. 

The room-temperature bonding equipment was recognized as a key project of the National Disruptive Technology Innovation Program and became one of the first six benchmark projects nationwide. 

Breakthroughs in the full chain of new materials and processes: SiC, LNOl, and POl substrates have achieved mass production and reached an international advanced level; domestic first breakthrough of diamond Smart-Cut; successful development of new processes such as Dual LNOl and GeOI. 

The complete line solution has received orders from leading clients, achieving the full "materials—process—equipment" closed-loop implementation.

Achieved mass sales of bonding equipment, with annual orders exceeding ¥300 million.

Released 8-inch LTOI/LNOI and 6-inch SiCOI composite substrates, marking international market breakthroughs.

Made significant progress in 6-8-inch SiC composite substrates, with results published at IEDM (IEEE International Electron Devices Meeting).

Approved to establish a postdoctoral research workstation.

Honored as a 2024 National High-Tech Enterprise.

Undertook a major National Natural Science Foundation research instrument project.

Closed B+ and B++ funding rounds, raising over ¥200 million.

Launched the SAB 82 and SAB 62HB series of high-precision hybrid bonding equipment, advancing Chiplet packaging and other cutting-edge services.

Launched the SAB 95 super atoms beam equipment, entering atomic-level manufacturing.

Commissioned the Tianjin SiC bonded substrate production line.

Recognized as a provincial-level "Specialized, Refined, Unique, Innovative" (SRUI) enterprise.

Awarded the Gold Prize at the National Postdoctoral Innovation & Entrepreneurship Competition.

Closed Series B funding, raising over ¥200 million.

Launched multiple high-end bonding equipment series, including SAB 83, SAB 63, and SAB 64.

Launched 6-inch advanced composite substrate materials (e.g., LTOI, LNOI).

Acquired a Japanese room-temperature bonding equipment company to expand overseas operations.

Closed A+ and A++ funding rounds, raising over ¥300 million.

Launched the Bonded Substrate Materials Division, initiating R&D on advanced composite substrates.

Delivered China’s first room-temperature bonding equipment, filling the domestic industry gap.

Closed Pre-A and Pre-A+ funding, raising nearly ¥200 million.

iSABers Group parent company was established, alongside the founding of the Heterogeneous Integration Equipment Division.

Secured angel-round funding.