The SAB6110 CST is a high-throughput production system for semiconductor and heterogeneous material bonding, featuring a multi-chamber cluster design, which integrates activation, baking, sputtering (ion beam/magnetron), alignment, and bonding functions. Each chamber equipped independent dry and molecular pumps for rapid vacuum pumping. The activation module efficiently removes surface oxides, while the baking module rapidly eliminates moisture. It supports edge/mark alignment modes. This equipment is compatible with automatic loading and unloading cassettes, meeting the requirements of high-efficiency mass production.