The SAB6100 is an R&D-grade bonding system designed for semiconductor and heterogeneous material integration.By UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding at room temperature. The system accommodates both standard size and custom-shaped wafers, enables the deposition of nanoscale films, and enhances bonding strength.

The SAB6110 is a high-throughput bonding system designed for semiconductor and heterogeneous material integration. By utilizing UHV bonding technology, it enables atomic-level surface activation and direct covalent bonding at room temperature. All standard-sized wafers are compatible. This equipment is equipped with automated wafer loading module, independent deposition chamber and high-precision alignment system, delivering stable processes and high-throughput.

The SAB6110 CST is a high-throughput production system for semiconductor and heterogeneous material bonding, featuring a multi-chamber cluster design, which integrates activation, baking, sputtering (ion beam/magnetron), alignment, and bonding functions. Each chamber equipped independent dry and molecular pumps for rapid vacuum pumping. The activation module efficiently removes surface oxides, while the baking module rapidly eliminates moisture. It supports edge/mark alignment modes. This equipment is compatible with automatic loading and unloading cassettes, meeting the requirements of high-efficiency mass production.