Features
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- Multi-material Compatibility
- Supports metal bonding, eutectic bonding, anodic bonding, and adhesive thermocompression bonding.
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- Superior Post-bonding TTV Performance
- Coating thickness uniformity ≤5%, bonding pressure uniformity ≤3%, temperature uniformity ≤1.2%, ensuring post-bonding TTV ≤3 μm.
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- Controlled Edge Bonding Quality
- Precise edge removal of adhesive, coupled with high-accuracy bonding pressure control, ensures edge bonding strength without adhesive overflow defects.
Specifications
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ItemsSpecification
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Wafer size4, 6, 8, 12 inch
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Max. temperature350℃
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Maximum bonding force20 kN
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Max. Heating rate20 ℃/min
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Temperature uniformity≤ ±1.5%
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Alignment accuracy≤ ±100 μm
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TTV after bonding≤ 3 μm
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Multi-module integratedPre-aligner, coating, baking, bond, detection
