Features
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- Flexible Debonding Methods
- Supports single or combined use of mechanical, thermal-sliding, or laser debonding.
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- Low-stress Thermal Slip Debonding
- Independent temperature control for upper/lower plates, coupled with stable thermal-sliding control, minimizes breakage rates.
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- Zero Damage Laser Debonding
- UV nanosecond laser with real-time focusing and power compensation achieves near-zero thermal damage during debonding.
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- Zero-residue Debonding
- Chemical and plasma dry cleaning ensure >99.9% adhesive removal.
Specifications
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ItemsSpecification
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Wafer size4, 6, 8, 12 inch
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Wafer loadCassette, SMIF, Foup Optional
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Debonding methodThermal-slide, laser debond
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Thermal-slide temperature350℃ (max.), independent upper/lower plate control
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Thermal-slide Speed0.1 mm/s~70 mm/s
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Laser wavelength355 nm
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Laser spot profileTop-hat
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Laser scanning area320 mm × 320 mm (max.)
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Cleaning chemical type≥2
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Spin speed for chemical cleaning3000 rpm (max.)
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Plasma cleaningOptional
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Multi-module integratedDebonding, detach, wet clean, plasma clean
