Features
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- Full-size Compatibility
- Supports polishing for diverse sample sizes, including irregular shapes.
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- High-reliability, Long-lifetime Ion Source
- Proprietary ion source ensures stable energy output and long-term operational reliability.
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- Ultra-precision Motion Platform
- Precisely controls ion beam incidence position and angle via an ultra-precision motion platform.
Specifications
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ltemsSpecification
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Wafer size2-12 inch and irregular shapes
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Wafer loadManual
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TransmissionManual/Customized tooling
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Removal rate20keV: ≥70 Å*cm² /s@SiO₂
60keV: ≥400 Å*cm² /s@SiO₂ -
Process gasesAr/SF₆/O₂/N₂ or other mixed gas
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Beam intensity＞100μA @Ar
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Beam spot sizeFWHM: 5-10 mm (adjustable)
