- Core Solutions
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Targeting bonding challenges in MEMS device manufacturing, iSABers offers room-temperature bonding + thermocompression/anodic bonding solutions. Room-temperature bonding requires no heating or cooling, reducing thermal stress; the fully automated thermocompression/anodic bonding platform is compatible with multiple bonding processes such as eutectic, anodic, and cavity fusion bonding, meeting the packaging requirements of inertial sensors, pressure sensors, microphones, and other MEMS devices.
Core Process 1：Room-temperature Bonding
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Process Capabilities
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Direct bonding after surface activation under ultra-high vacuum, without heating, reducing thermal stress. Supports direct bonding (no intermediate layer) and enhanced bonding (1–50 nm intermediate layer: Si, Ge, metals, oxides, etc.).
Core Equipment: SAB6110 CST Fully Automatic High-throughput Room-temperature Bonding Equipment
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Efficient automated loading/unloading: cassette/in-house dark box/EFEM
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Ultra-high vacuum system, bonding chamber < 7E-6 Pa
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Maximum bonding force: 100 kN, bonding force control accuracy: ≤ ± 1%
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Activation etch rate > 10 nm/min, WPH ≥ 12
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Wafer baking chamber for moisture removal
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4-12 inch
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Wafer size
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±1%
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Pressure divergence
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≤ ±1 μm
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Bonding accuracy
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WPH≥ 12
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Throughput
- SAB6110 CST-Fully Automatic High-throughput
- UHV RT Bonding Equipment
Core Process 2：Fully Automatic Multi-process Bonding Platform
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Process Capabilities
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Eutectic bonding (AuSn, AlGe): metal sealing, high reliability
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Anodic bonding (glass-Si): transparent packaging, no metal patterning required
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Cavity fusion bonding: all-Si structure, no thermal mismatch
Core Equipment: SAB6310 Fully Automatic Thermocompression/Anodic Bonding Equipment
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Flexible configuration: 0–2 activation modules, up to 4 bonding modules
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Alignment accuracy: ≤ ±200 nm
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Bonding accuracy: Fusion/anodic ±2 μm, AlGe eutectic ±8 μm
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6-12 inch
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Wafer size
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550℃
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Maximum temp.
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100 kN
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Maximum bonding force
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≤ ±2 μm
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Bonding accuracy
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Optional
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Hydrogen radical activation
- SAB6310-Fully Automatic
- TC Anodic Bonding Equipment
- Room-temperature Bonding
- No heating or cooling needed, significantly reducing thermal stress and delivering excellent heterogeneous bonding capability
- Full-process Coverage
- Activation → alignment → bonding → cooling, delivered as a one-stop solution
- Multi-process Compatibility
- One platform supports eutectic, anodic, and cavity fusion bonding
- High Precision
- Alignment accuracy ≤ ±200 nm
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Inertial MEMS (accelerometers, gyroscopes)
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Pressure sensors (high-temperature, automotive, medical)
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Microphones
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RF MEMS, optical MEMS
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Hermetic packaging, vacuum packaging
