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Addresses warpage, flux residue, and fine-pitch interconnection reliability, supporting applications such as HBM, CoWoS, and Chiplet. -
Targeting bonding challenges in MEMS device manufacturing, iSABers offers room-temperature bonding + thermocompression/anodic bonding solutions. -
Targeting the challenges of silicon photonics heterogeneous integration, iSABers offers a full-process solution combining super-atoms beam surface treatment and heterogeneous bonding. -
Targeting bonding challenges in MicroLED manufacturing, iSABers offers full-process bonding solutions. -
Targeting heat dissipation challenges in GaN power devices, iSABers offers a substrate transfer + room-temperature bonding solution.
