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- 2023-05-26
- Domestic First Advanced Semiconductor Composite Substrate Production Line Operational; iSABers Secures Investments from Renowned Institutions
"Currently, the domestic market demand for advanced semiconductor composite substrate materials, particularly silicon carbide (SiC), far exceeds supply. Major application sectors include new energy vehicles, photovoltaics, and power transmission," according to industry insights. The first-phase production capacity of this line is 30,000 wafers, with plans to expand to 150,000 wafers in the future. Substrate sizes primarily focus on 6 inches, with a roadmap to transition to 8 inches.
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- 2023-05-22
- Integration and Breakthrough! iSABers Tianjin Composite Substrate Production Line Commissioning Ceremony Successfully Held
On May 19, 2023, the "Integrate Innovation, Break Boundaries" commissioning ceremony for iSABers’ Tianjin new bonding-integrated substrate mass production demonstration line was successfully held in Binhai High-Tech Zone! This milestone signifies China’s strategic breakthrough in the fiercely competitive global semiconductor market, carrying significant implications for promoting high-quality development of China’s semiconductor industry, filling domestic market gaps, and strengthening independent innovation capabilities. The event attracted leaders and experts from government, industry, academia, research, and investment sectors, who jointly witnessed this major industry occasion.
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- 2023-05-22
- The 7th World Intelligence Conference Parallel Forum - China Information and Innovation Industry Development Summit's Semiconductor Materials and Device Fusion Technology Forum is grandly opened
In order to strengthen breakthroughs in semiconductor materials and device technology and promote the leapfrog development of domestic semiconductor technology, on May 19, 2023
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- 2023-05-17
- Dialogue with Top Bonding Technology Experts: How Wafer Bonding Transcends More than Moore | Jiazi Guangnian
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- 2023-05-12
- Academic Forum | Interconnection Technology Symposium to Be Held in Tianjin Binhai New Area on May 17
Hosted by Beijing iSABers Semiconductor Technology Co., Ltd., the "Interconnection Technology Symposium" will take place in Tianjin Binhai New Area on May 17. The forum aims to strengthen exchanges in semiconductor interconnection technologies and promote leapfrog breakthroughs in domestic semiconductor technology.
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- 2023-01-16
- Good News | Dr. Mu Fengwen, Chairman of Beijing iSABers Group, Selected for 2022 Beijing Science and Technology Star Program
The Beijing Science and Technology Star Program is a science and technology talent cultivation initiative supported by Beijing municipal fiscal funds and implemented by the Beijing Municipal Science and Technology Commission. It aims to identify outstanding young scientific and technological backbones, carry out technological innovation through project-based initiatives, enhance research capabilities and management skills, and cultivate a group of young scientific and technological leaders with high political integrity, strong innovation capabilities, and a spirit of innovation.
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- 2022-12-24
- Warm congratulations on the successful holding of the first equipment moving-in and launching ceremony of iSABers' Tianjin composite substrate production line!
On December 23rd, the first equipment moving-in and launch ceremony for iSABers' Tianjin Composite Substrate Mass Production Demonstration Line— a leading enterprise in semiconductor heterogeneous integration technology— was successfully held at the Binhai High-tech Zone's Bolonghu Science and Technology Park in Tianjin. Xia Qinglin, Secretary of the Party Committee and Director of the Management Committee of Tianjin Binhai High-tech Zone; Dr. Mu Fengwen, Chairman of iSABers; Luo Longfei, Executive General Manager of China International Capital Corporation (CICC); Zhou Quan, Partner of Shenzhen InnoFortune Fund Management Co., Ltd.; Yang Bo, Partner of Shanghai Weihao Chuangxin Investment Management Co., Ltd.; and Li Yong, Partner of Deheng Law Offices, attended the ceremony.