POI-Acoustic Grade LTOI Substrate
POI (Piezoelectric on Insulator) consists of a high-resistivity silicon substrate, a buried oxide layer as the intermediate layer, and a thin, uniform mono-LT film on top. In RF applications, POI is a critical material for 5G/6G filters and resonators, thanks to its high-frequency and low-loss characteristics. Heterogeneous integration technology enables ultra-thin monocrystalline layers with a high electromechanical coupling coefficient, excellent temperature stability, and high-Q resonance. Its core specifications are benchmarked against those of leading international companies, and its performance meets the requirements of high-end applications, making it ideal for high-performance filters.
POI-Acoustic Grade LTOI Substrate (H-Cut)

  • Items
  • Specification
  • Diameter
  • 150±0.2 mm
  • LT Crystal Orientation
  • Y36°/Y42°/Y50°±0.3°
  • LT Layer Thickness Mean
  • (300~1000)±20 nm
  • Layer Thickness Range
  • <40 nm
  • Front Side Surface Finish
  • <0.5 nm
  • Buried Oxide Layer Thickness Mean
  • (300~1000)±20 nm
  • Buried Oxide Layer Thickness Range
  • <40 nm
  • Trap-Rich Layer Average Thickness
  • {0.5-1.5 μm}±0.1 μm
  • Si Orientation
  • <100>, <110> ,<111>, etc.
  • TTV
  • ≤5 μm
  • BOW
  • -50~50 nm
  • Warp
  • <50 μm
  • Total Thickness
  • 675±25 μm
POI-Acoustic Grade LTOI Substrate (Thinning)

  • Items
  • Specification
  • Diameter
  • 150±0.2 mm
  • LT Crystal Orientation
  • Y36°/Y42°/Y50°±0.3°
  • LT Layer Thickness Mean
  • (2~50)±0.5 μm
  • Layer Thickness Range
  • <2 μm
  • Front Side Surface Finish
  • <0.5 nm
  • Si Orientation
  • <100>, <110>, <111>, etc
  • TTV
  • ≤5 μm
  • BOW
  • -50~50 nm
  • Warp
  • <50 μm
  • Total Thickness
  • 675±25 μm
POI-Acoustic Grade LTOI Substrate (Thinning)


  • Items
  • Specification
  • Diameter
  • 150±0.2 mm
  • LT Crystal Orientation
  • Y36°/Y42°/Y50°±0.3°
  • LT Layer Thickness Mean
  • (300~10000)±50 nm
  • Layer Thickness Range
  • <100 nm
  • Front Side Surface Finish
  • <0.5 nm
  • Buried Oxide Layer Thickness Mean
  • (300~1000)±20 nm
  • Buried Oxide Layer Thickness Range
  • <40 nm
  • Trap-Rich Layer Average Thickness
  • {0.5-1.5 μm}±0.1 μm
  • Si Orientation
  • <100>, <110> ,<111>, etc.
  • TTV
  • ≤5 μm
  • BOW
  • -50~50 nm
  • Warp
  • <50 μm
  • Total Thickness
  • 675±25 μm
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