SiCOI Substrate
SiCOI (Silicon Carbide-on-Insulator engineered wafer) leverages a proprietary fabrication process to fully exploit the intrinsic properties of High-Purity Semi-Insulating (HPSI) SiC, significantly enhancing the overall performance of semiconductor devices (e.g., high Q-factor). Its outstanding optical properties find critical applications in second harmonic generation, electro-optic modulators, optical frequency combs, PICs, etc.
SiCOI Substrate

  • Items
  • Specification
  • Diameter
  • 150±0.2 mm
  • SiC Polytype
  • 4H
  • SiC Resistivity
  • ≥1E8 ohm·cm
  • SiC Mean Thickness (21 Pts)
  • ≥0.5 μm
  • SiC Thickness Range
  • ≤2000 A
  • Front (C-face) roughness
  • Ra≤0.2 nm (5 μm*5 μm)
  • Oxide thickness
  • (0~3000) ±5% nm
  • SI Orientation
  • <100>, <110>, <111>, etc.
  • Si Type
  • P/N
  • Edge Chip, Scratch, Crack (visual inspection)
  • None
  • TTV
  • ≤5 μm
  • Thickness
  • 500-675 μm
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